I. SUMMARY
This paper examines PostProcess Technologies’ newly released resin removal chemistry, PLM-403-SUB (referred to as 403 from here on), as part of its comprehensive Automated Resin Removal Solution. It will review the effectiveness across a range of materials, safe operations, and process optimizations as compared to traditional alternatives isopropyl alcohol (IPA) and tripropylene glycol monomethyl ether (TPM).
The goal of the new 403 chemistry is to, in concert with the software and hardware components of the resin removal solution, ease the multiple burdens that typically arise when removing uncured resin following various Vat Photopolymerization processes. With this solution, users can dramatically reduce cycle times, process steps, and the typical operational risk factors that come with legacy resin removing solvents.